To provide for manufacture of products at present time our company is ready to propose 2 lines of surface mounting with total productivity up to 70 000 components/hour.
The lines of different configuration with various equipment allow to fulfill the orders from several pieces up to large series batches.
The modern equipment allows to manufacture the electronic assemblies of high complexity degree and also has the following advantages that are positively reflected on the quality of products:
Types of components to be installed | chips 0201, 01005, melf, electrolytic condensers, SO, PLCC, QFP, TSOP, BGA, μBGA, LGA, CSP, connectors and components of surface mounting of incorrect form |
Maximum height of the component | 34 mm |
Maximum size of the printed circuit board | 508х508mm |
Thickness of the printed circuit board | minimum: 0.5 mm, maximum: 6 mm |